High{{0}Voltage Silver Plated BUSBAR Terminal Stamping Die bakeng sa NEV Powertrain Systems
Precision E Enjinetsoe Bakeng sa Pelo ea Matla a NEV
Sebakeng se fetohang ka potlako sa Likoloi tse Ncha tsa Matla (NEVs), sistimi ea powertrain e batla likarolo tsa ts'epo, ts'ebetso le polokeho tse ke keng tsa bapisoa. Kokong ea -kabo ea motlakase e matla ka har'a litsamaiso tsena ke boemelo ba BUSBAR. -Voltage Silver Plated BUSBAR Terminal Stamping Die ea rona ha se sesebelisoa feela; ke tharollo e entsoeng ka makhethe e etselitsoeng ho etsa lihokelo tsa bohlokoa tsa conductive tse matlafatsang moloko o latelang oa motsamao oa motlakase. Re sebetsa ka thata ho hlahisa litempe tse nepahetseng tse fetolang-oxyjene e sebetsang-Koporo ea Mahala hore e be litheminale tse rarahaneng,{7}}tse mamellang BUSBAR tse phahameng, tse phethiloeng ka mokhoa o tsitsitseng,{8}}o phahameng{8}} oa plating ea silevera, kaofela tse etselitsoeng litlhoko tse thata tsa lits'ebetso tsa NEV.
Lethathamo lena le kenyelletsa boitlamo ba rona re le China{{0}moetsi oa lisebelisoa-oa mohloli oa lisebelisoa ho fana ka boenjiniere ba maemo a holimo, phetoho e potlakileng, le boleng bo ikhethang ntle le ho sekisetsa litekanyetso tse thata tse hlokoang ke liindasteri tsa lefatše tsa likoloi le tsa elektroniki.
Litlhaloso tsa Sehlahisoa & Likarolo tsa Bohlokoa
Tafole e latelang e akaretsa lintlha tsa mantlha le bokhoni ba tlhahiso ea rona e tloaelehileng bakeng sa karolo ena ea bohlokoa:
|
Paramethara |
Tlhaloso / Tlhaloso |
|
Lebitso la Sehlahiswa |
High{{0}Voltage Silver Plated BUSBAR Terminal Stamping Die bakeng sa NEV Powertrain Systems |
|
Boitsebiso ba Sehlahisoa |
Oksijene-Copper T2 ea Mahala (C11000), Botenya=1.5mm (O ka e etsa ka mokhoa o ikhethileng ho ea ka setšoantšo: 0.8mm - 3.0mm) |
|
Mokhoa oa ho hatakela |
Progressive Stamping Die (Fully Automated, High-Lebelo) |
|
Lefu Sebopeho |
Modular, Precision-Guided Progressive Die. E na le lintho tse kenyang{2}ka potlako, li-punch plates tse tataisoang, le lisebelisoa tsa lifti tse ikemetseng bakeng sa ho fokotsa nako le ho li lokisa habonolo. |
|
Kalafo ea Bokaholimo (Karolo) |
0.5μm Selefera (Ag) Lera Bonyane. Die e etselitsoe ho etsa bonnete ba hore ho khomarela plating e le 'ngoe le ho thibela ho ebola kapa ho se lumellane karolong ea ho qetela ea setempe. |
|
Key Processing Tech |
Precision Grinding, High{0}}Speed Wire{{1}Ho Seha (HS-WEDM), CNC Machining, Profile Grinding, Electrical Discharge Machining (EDM). |
|
Bokhoni ba Tlhahiso |
E khona ho ts'ehetsa{0}}tlhahiso ea molumo o phahameng o fetaLikarolo tse limilione tse 10 ka khoeli, ho itšetlehile ka karolo e rarahaneng le ho tobetsa tonnage. |
|
Tooling Standards |
E sebelisa litekanyetso tsa machaba tsa premium:Meusburger, Hasco, Misumi, leDMEbakeng sa metheo ea hlobo, likarolo tsa tataiso, le lisebelisoa, ho netefatsa phetoho ea lefats'e le ho ts'epahala. |
|
Die Material |
Premium Tool Steels & Carbides: SKD11 (bakeng sa punches/formers), CD650 (high-wear inserts), ASP23/ASP60 (bakeng sa-disebediswa tse hodimo- tse telele), Ceratizit CF-H40S (carbide bakeng sa disebediswa tse fetelletseng). |
|
Likopo tse reriloeng |
NEV (BEV, PHEV) Powertrain Systems (Battery Packs, Inverters, DC-DC Converters, On{1}}board Chargers). Kabo ea Motlakase oa Sefofane, Lisebelisoa tsa ho Etsa Litšoantšo tsa Bongaka, Ho Phahameng-Mekhoa e nepahetseng ea Taolo ea Indasteri, Khokahano e Hatetseng Pele ea Motlakase. |
|
Guaranteed Die Life |
10 million strokes bonyanetlas'a liprothokholo tse tloaelehileng tsa tlhokomelo, ka lebaka la lisebelisoa tsa premium, phekolo e nepahetseng ea mocheso, le moralo o matla. |
Molemo oa rona oa mantlha: Bespoke Precision Metal Stamping Die Development
Ha re barekisi ba lisebelisoa feela; re balekane ba hau ba nts'etsopele ea lihlahisoa le lisebelisoa. Matla a rona a ho fetolela mohopolo oa hau le lintlha tsa hau hore e be{1}}mosebetsi o phahameng, o tšoarellang oa setempe.
Tšebeletso e Felletseng ea Boenjiniere: Ho tloha litšoantšong tsa hau tsa pele tsa karolo ea 2D/3D (IGES, STEP, CATIA, UG, SolidWorks formats), sehlopha sa rona sa baenjiniere ba nang le phihlelo ba meralo se etsa tlhahlobo e phethahetseng ea DFM (Design for Manufacturability). Re hlwaya mathata a ka bang teng, re sisinya dintlafatso bakeng sa ditjeho le tshebetso, le ho netefatsa hore karolo ya moralo e loketse bakeng sa-ho fumana setempe se phahameng.
Netefatso ea Virtual ka Ketsiso ea CAE: Pele re seha tšepe efe kapa efe, re sebelisa CAE (Computer{0}}Aided Engineering) Ho Etsa Simulation (ho sebelisa software e kang AutoForm kapa Dynaform). Mohato ona oa bohlokoa o bolela esale pele phallo ea thepa, khatello ea maikutlo/kabo ea khatello, ho fokotseha ho ka bang teng, ho khutlela morao, le ho felisa teko e bitsang chelete e ngata-le{3}}phoso. Re rarolla mathata sethaleng sa sebele, ho tiisa tsela e bonolo ho ea sesebelisoa se atlehileng sa 'mele.
Ts'ebetso e Kopantsoeng ea Nts'etsopele: Litšebeletso tsa rona{0}} tse felletseng li netefatsa hore projeke e tsoela pele ntle le mathata:
LisebelisoaMoralo: Moralo oa sebopeho sa 3D / 2D se nang le meralo e qaqileng.
Khetho ea Lintho: Ho eletsa ka lisebelisoa tse nepahetseng tsa tšepe / carbide ho ipapisitse le karolo ea thepa, molumo, le litlhoko tse nepahetseng.
Precision Manufacturing: Litšepiso tsa rona tsa boenjiniere le boleng li tšehetsoa ke matsete a bohlokoa ho theknoloji e tsoetseng pele ea tlhahiso le tekanyo, Lenane le ka sehloohong le ka tlase:
|
Mofuta oa Thepa |
Mohlala & Bongata |
Bokhoni ba Bohlokoa / Nepahetseng |
|
EDM (Sinker) |
Sodick AD32LS, Makino EDG2/EDG3 (kakaretso ea likarolo tse 6) |
Complex cavity machining, top finish Ra<0.4μm. |
|
Mohala{{0}Seha EDM |
Sodick AQ360LS, Seibu M50B (kakaretso ea likarolo tse 7) |
Ho seha-ka lebelo le holimo ka nepo, ho seha ka mokhoa o hlakileng, ho beha maemo ka nepo ±0.002mm. |
|
Sesila sa holim'a metsi |
Yutong 618S (10 diyuniti) |
Ho sila hantle ha libaka tse bataletseng, ho tšoana ho ka hare ho 0.002mm. |
|
Profile Grinder |
Waida (2 diyuniti) |
Ho sila ka mokhoa o nepahetseng oa li-profiles tse rarahaneng tsa punch le die. |
|
CMM |
Hexagon CMM Inspector (1 unit) |
Tlhahlobo e felletseng ea 3D, ho nepahala ho fihla ho (1.8+L/350)μm. |
|
Optical Projector |
Nikon V-12B (likarolo tse 3) |
Tekanyo ea 2D contour, ho holisa ho fihla ho 100X. |
|
Altimeter |
Nikon * likarolo tse 8 |
Tekanyo ea botebo le Bophahamo, +-0.001mm |
Pontšo e tsoetseng pele ea Kamore ea Lisebelisoa
Kopana le ho Leka-Ho Tsoa: Litsebi tse hloahloa lia bokana 'me tsa etsa liteko- tsa pele ka har'a{1}}mohatlalatsi oa ntlo (25-110 Tonnage range).
Tlhahiso ea Teko & Tokiso:Re etsa liteko tse nyane tsa batch, re lekanya lisampole ka lisebelisoa tse nepahetseng (Hexagon CMM, Nikon Projector), 'me re lokisa-fate hore re fihlele likarolo tse phethahetseng.
Handoff ea tlhahiso ea bongata: Re fana ka tlhahiso-e loketseng ho shoa, e tsamaeang le litokomane tse felletseng le lintlha tsa tšebetso.
{{0}Tshehetso ea Tlhahiso e Phahameng ea Stamping ea Bolumo
Lefu le leholo le hloka tikoloho e nang le bokhoni ba tlhahiso. Re etsa bonnete ba hore likarolo tsa hau li ka etsoa ka mokhoa o tsitsitseng.
Ka-Ka tlungTlhahiso Thepa (Ho bopa + Ho hatakela):
- 35+ Mechini e bopang ka ente e nepahetseng haholo(30T~300T) ho tsoa ho mofuta oa mantlha,
- 18+ metjhini ea litempe e nepahetseng haholo le e lebelo haholo((25T~110T) ho tsoa ho mofuta oa mantlha.
- 15+ lilemo tsa boiphihlelo ba OEM/ODM.
- Qetella-ho{1}}ho felisa litharollo ho tloha ho moralo ho isa ho delibari.
Seleng ea Tlhahiso e inehetseng: Bakeng sa merero e kang High-Voltage BUSBAR Terminal, re ka theha mohala o ikemiselitseng oa tlhahiso, o kopantseng li-feeders, ka-tlhahlobo ea pono, le ho paka, ho netefatsa hore ho tsamaea ka mokhoa o tsitsitseng ho tloha ho coil stock ho ea ho tse feliloeng, tse hlahlobiloeng.
Scalability: Setsi sa rona le marang-rang a balekane li re lumella ho holisa tlhahiso ho fihlela tlhokahalo e eketsehang, ho fana ka phepelo e tšepahalang bakeng sa mananeo a hau a NEV.
Pontšo ea Sebaka sa Tlhahiso
Taolo e Matla ea Boleng: E kenyelelitsoe Ts'ebetsong e 'ngoe le e' ngoe
Joalo ka feme e netefalitsoeng ea ISO9001&IATF16949&ISO14000, Boleng bo entsoe molemong o mong le o mong, ho tloha tlhahlobong ea thepa ho isa thomelong ea ho qetela.
Lintho tse Kenang QC
Lisebelisoa tsohle tsa tšepe le likarolo tse tloaelehileng li netefalitsoe le ho netefatsoa bakeng sa kereiti le litekanyo.
Litokomane Tse Feletseng
Tlaleho e felletseng ea tlhahlobo, ho kenyeletsoa le litifikeiti tsa thepa,-data ea pele ea tlhahlobo ea sengoloa (FAI) le likarolo tsa mohlala, e tsamaisana le lefu le leng le le leng le romelloang.
E -Tlhahlobo ea Ts'ebetso (IPQC)
Mohato oa ho Macha: Likaroloana tsa bohlokoa li lekanyetsoa ho sebelisoa li-projeke tsa Nikon (liyuniti tse 3) le li-altimeter tsa Nikon (liyuniti tse 8) ka mor'a ho sila le ho seha terata{2}}. Ho sila profaele ho netefalitsoe ho liprojeke tsa Wanhao 2D (likarolo tse 4).
Pele-Tlhahlobo ea Kopano: Lintlha tsohle lia hlahlojoa pele ho kopano ea ho qetela ho netefatsa hore li lekana hantle.
Netefatso ea ho Qetela le Thuto ea Bokhoni
Mehlala ea pele{{0}ea ho leka{1}}e lekantsoe ka makhethe ho sebelisoa Hexagon CMM Inspector bakeng sa tlaleho e felletseng khahlano le mehala ea hau ea GD&T.
We perform a CPK (Process Capability Index) study on critical dimensions (e.g., terminal pin width: 2.50±0.03mm, pin spacing: 5.00±0.05mm) using data from multiple consecutive strokes to statistically prove the die's stability and capability (target CPK >1.33).
Laboratori e tsoetseng pele ea tlhahlobo ea lihlahisoa
Bopaki ba Kopo ho NEV Powertrain
|
Tsamaiso |
Phethahatso |
Lintlha tsa netefatso |
|
Pakete ea Battery |
Mehala ea Khokahano ea Lisele |
0 e hlolehile ho likarolo tse 500,{2}} (2023) |
|
Molaoli oa makoloi |
SiC Inverter Terminals |
Ts'ebetso e tsoelang pele ea 175℃e netefalitsoe |
|
PDU |
Setsi sa Kabo e ka Sehloohong |
Ho fetile 50kA{1}}teko e khutšoane ea potoloho (ISO 6469-3) |
|
Multi-Domain Controller |
Lihokelo tsa Zonal Gateway |
EMC shielding >60dB @ 1GHz |
|
Boema-kepe ba ho tjhaja |
CCS Combo Interface |
10,000 cycles tsa ho nyalana @ IP6K9K lintlha |
Moralo oa Tšebelisano ea Setsebi
Thuto-pale
Morero oa kopo
Sethala sa 800V sa mofani oa thepa oa Tier 1 bakeng sa BYD Blade Battery Systems
01
Ts'ebetso ea phepelo
Ka{{0}matsatsi a ntshetsopele ya disebediswa tsa ka tlung{1}}e loketse tlhahiso e kgolo
02
Tshebetso ea Boleng
E bolokile 0 PPM nakong ea likhoeli tse 18
03
Tlhokahalo ea Selemo
8M likhomphutha
04
Ke Hobane'ng ha U Sebelisana le Rōna? Boleng bo Feta Theko
Joaloka moetsi oa lisebelisoa tsa mohloli o tobileng Chaena, re fana ka melemo e matla:
Litšenyehelo-Bokhabane bo Sebetsang
Tlosa li-markups tse mahareng. Re fana ka- lisebelisuoa tsa boleng bo holimo ka theko ea boleng bo holimo ka ho ntlafatsa moralo, ho sebelisa lisebelisoa tsa lehae, le ho sebetsa ka bokhabane.
Lebelo le Boqhetseke
Sehlopha sa rona sa boenjiniere se tsepamisitseng maikutlo le sebopeho sa botsamaisi se thusa karabelo e potlakileng ho li-RFQ le liphetoho tsa moralo. Nako e tloaelehileng ea ho etella pele bakeng sa lefu le rarahaneng le tsoelang pele joalo ka libeke tse 8-10, ho tloha ho tatellano ho isa sampole ea pele.
Tšebelisano{{0}ea Nako e Telele
Re bona morero o mong le o mong e le qalo ea-ea likamano tsa nako e telele, ho fana ka tšehetso e tsoelang pele ea tekheniki, likeletso tsa tlhokomelo, le tsamaiso ea bophelo bakeng sa lisebelisoa tsa hau.
Ikopanye le rona kajeno ho buisana ka lintlha tsa hau tse khethehileng tsa-Voltge BUSBAR Terminal kapa litlhoko tse ling tse nepahetseng tsa setempe. E re sehlopha sa rona sa boenjiniere se fane ka tlhahlobo e felletseng ea DFM le khotheishene ea tlholisano, e bonts'ang hore na re ka ba balekane ba hau ba ts'eptjoang joang tabeng ea ho hatakela tšepe ka nepo.
Hot Tags: liteishene tsa liteishene tsa busbar li stamping die, China liteishene tsa busbar stamping bahlahisi, barekisi, feme
